Glass Core Substrate

Solid metal electrode inserted glass wafer (TGV)

Glass core substrates are gaining attention in heterogeneous integration technology. AMBRO has established hermetic glass molding technology that integrates solid-type electrode (Cu, W, Mo, etc.) pins into TGV and cavity+TGV structures. Development targets by end of 2026: GCS hole diameter 50μm, pitch 100μm, aspect ratio 1:10.